IC & SENSOR PACKAGING TECHNOLOGY EXPO 2027

IC Sensor Packaging Technology EXPO

Asia’s leading exhibition for IC final manufacturing, gathering advanced equipment, materials, and services. The event is held across multiple editions in Tokyo, Osaka, and Nagoya, featuring a Technical Conference organized by industry-leading experts.

المعارض الرئيسية والمراكز

• IC Sensor Packaging
• الإنتربول اليابان
• اليابان
• Electronic Components and Materials
• Printed Wiring Board (PWB)
• Fine Process Technology
• Power Devices and Modules
• EMS and ODM

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سجل الدخول أو المقصورات

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خريطة وفندق حول

Koto - Tokyo Big Sight, Tokyo, Japan

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التعليقات