آخر التطورات

تحديث الطبعة القادمة

وحدة التصميم

منFebruary 02, 2027 حتىFebruary 04, 2027

AtSanta Clara - Santa Clara Convention Center, California, USA جنية الزفاف Categories:Telecom Industry تاغز:التصميم.,المعدات.,Semiconductors.,الإلكترونيات.,التعليم.,الهندسة.,الاتصالات.,المؤتمرات.,معرض.,الربط الشبكي.,التكنولوجيا

https://www.designcon.com/en/home.html

عرض عام للحدث

DesignCon is the premier high-speed communications and system design conference and exposition for chip, board, and systems design engineers, held in the heart of electronics innovation.

المعارض الرئيسية والمراكز

• Conference Program: Features 15 expertly curated tracks with over 100 sessions, including technical papers, tutorials, and industry panels created by engineers for engineers.
• Core Topics: Covers all aspects of electronic design, notably signal and power integrity, high-speed link design, and machine learning.
• Expo Hall: Showcases hundreds of new products and technologies, interactive demos, and the Chiphead Theater for educational sessions.
• Keynotes: Presentations by industry visionaries and leading experts, open to all attendees.
• الجوائز: Hosts the annual "Engineer of the Year" award recognizing outstanding leadership, creativity, and advancements in chip, board, or system design and test.