NEPCON Japan - Electronics R&D and Manufacturing Technology Expo 2027
NEPCON JAPAN is Asia’s premier electronics R&D, manufacturing and packaging exhibition, held February 17‑19, 2027 at Tokyo Big Sight. The event gathers an estimated 1,800 exhibitors and 88,000 visitors and features eight specialised shows: Power Device & Module Expo, IC Sensor Packaging Expo, PWB (Printed Wiring Board) Expo, Electronic Components & Materials Expo, Fine Process Technology Expo, EMS & ODM Expo, Electrotest Japan, and Inter‑NEPCON Japan. In addition to the exhibition floor, a technical conference programmed by industry experts runs alongside, covering the latest advances across these categories. The show serves as a one‑stop venue for electronics manufacturers, designers, and suppliers seeking new technologies, components, and process solutions.
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كوتو – توكيو بيج سايت، طوكيو، اليابان